A recording head pole production process, and a pole made by the process, in which a combination of wet and dry etching steps are utilized to advantageously provide an undercut in the relatively high magnetic moment material beneath a photoresist area used to define the pole such that any re-deposited layer of material which occurs on the sides of the pole and photoresist area during the dry etching operation is advantageously rendered substantially discontinuous, or weakly linked, and the re-deposited material remaining on the pole itself following a photoresist strip can then be removed by being subjected to a stream of gaseous particles and ultimately carried away by the accompanying gas stream itself. In a particular embodiment disclosed herein the relatively high magnetic moment material may comprise a sputter deposited layer of cobalt-zirconium-tantalum (CoZrTa), iron-aluminum-nitride (FeAlN), iron-tantalum-nitride (FeTaN), iron-nitride (FeN) or similar materials. The stream of gaseous particles may be formed utilizing the expansion of a gaseous material, such as liquid carbon dioxide (CO2), through a nozzle directed at the re-deposited material remaining on the pole following the photoresist strip operation.
Drawings
Claims12
A process for producing a magnetic recording head pole comprising:
providing a substrate;
forming a layer of relatively high magnetic moment material on a surface of said substrate;
patterning a photoresist area on an exposed surface of said formed layer to define said pole;
removing a portion of said exposed surface of said formed layer at least partially underlying said photoresist area to a predetermined lateral width and depth;
further removing said formed layer surrounding said photoresist area to produce said pole;
stripping away said photoresist area overlying said pole;
and
substantially removing any re-deposited material remaining on said pole.
5 more elements
A process for removing re-deposited material in a thin film device structure comprising:
providing a source of a gaseous material;
and
directing said gaseous material through a nozzle directed toward said thin film device to produce particles and an associated gas comprising said gaseous material, said re-deposited material being respectively removed and carried away from said device structure by said particles and associated gas.
24 May 2019Estimated · howhide20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.
Details: shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect,…
Life of this patent
Term ended 24 May 2019 (estimated)
Priority24 May 1999
Filed31 Dec 2002
Granted3 Feb 2004
Term ended24 May 2019
Priority24 May 1999
Granted3 Feb 2004
Term ended24 May 2019
Priority claimedParent application 09/317,484
Application filedUS 10/335,685
PublishedUS 2003/0094432 A1
GrantedUS 6,685,845 B2
Assigned to Jpmorgan Chase Bank, N.A., AS Administrative Agent and First Priority Representative, Wells Fargo Bank, National Association, AS Collateral Agent and Second Priority Representativesecurity agreement
Assigned to The Bank of Nova Scotia, AS Administrative Agentsecurity agreement
Assigned to Seagate Technology LLC, Evault Inc. (F/K/A I365 Inc.), Seagate Technology International, Seagate Technology US Holdings, Inc.termination and release of security interest in patent rights
#The present invention relates, in general, to the field of magnetoresistive (“MR”) and giant magnetoresistive (“GMR”) recording heads. More particularly, the present invention relates to a process for producing poles in a magnetic recording head utilizing sputtered materials and a magnetic recording head made thereby.
#MR and GMR read heads, or sensors, are known to be useful in reading data from a magnetic surface with a sensitivity exceeding that of inductive or other thin-film heads. In operation, the sensor is used to detect magnetic field signal changes encoded on a magnetic surface through a change in resistance which is exhibited due to the direction and strength of the associated magnetic flux being sensed. Currently, the magnetic field signal changes representing the data encoded on the particular storage medium is “read” by an MR or GMR read head and “written” by a related write, or recording, head. In those instances wherein the read head has associated shield layers, the write head may utilize the “top” shield as a bottom pole thereby providing what is known as a “merged” or “shared” shield pole structure. In any event, a typical thin film recording head ultimately comprises two magnetic poles, a top and bottom pole that surround a coil forming a write gap.
#In conventional magnetic recording heads, nickel iron (NiFe), or permalloy, is generally used as the pole material. However, as the recording areal density of storage devices continues to increase, more advanced pole materials having a higher magnetic moment are required. While conventional permalloy poles can be produced using well known electroplating techniques and result in relatively well defined edge profiles and good width control, many of the known high magnetic moment materials such as cobalt-zirconium-tantalum (CoZrTa), iron-aluminum-nitride (FeAlN), iron-tantalum-nitride (FeTaN) and iron nitride (FeN) can only be sputter deposited, thereby making it extremely difficult to pattern and produce well defined poles.
Brief description of the drawings3 figures
#The aforementioned and other features and objects of the present invention and the manner of attaining them will become more apparent and the invention itself will be best understood by reference to the following description of a preferred embodiment taken in conjunction with the accompanying drawings, wherein:
#FIG. 1A illustrates a conventional process step in the formation of a pole for a magnetic recording head in which the pole is defined by a photoresist area and wherein the structure is then subjected to a dry etching operation, such as ion milling, and which results in the undesired and continuous re-deposition of material on the sides of the pole and the photoresist area;
#FIG. 1B illustrates a follow-on operation to the conventional process step shown in FIG. 1A following the stripping of the photoresist area and wherein the re-deposited material adhering to the pole remains as undesired “bunny ears” which promote the formation of voids between them following encapsulation (or overcoat), particularly with the narrow pole widths required for higher areal recording density using relatively high magnetic moment materials;
Detailed description1,517 words
#With reference now to FIG. 1A, a conventional process step in the formation of a pole 10 for a magnetic recording head is shown. In this example, a relatively high magnetic moment material 12 has been previously sputtered on a substrate (not shown) and the pole 10 has been defined by an overlying photoresist area. The structure has then been subjected to a dry etching operation, such as ion milling process, and an undesired and continuous re-deposition of the high magnetic moment material 12 comprising re-deposited material 16 can be observed to have occurred on the sides of the pole 10 and the photoresist area 14.
#With reference additionally to FIG. 1B, a follow-on operation to the conventional process step shown in FIG. 1A is shown following the stripping of the photoresist area 14. As can be seen, the re-deposited material 16 adhering to the pole 10 remains as undesired “bunny ears” 18 which lead to voids in subsequent encapsulation (or overcoat), particularly when used in conjunction with narrow track width heads needed for high density storage devices.
#With reference additionally now to FIGS. 2A through 2G, a representative processing sequence in accordance with the present invention is shown. As illustrated in FIG. 2A, a substrate 50 is provided for subsequent forming of a relatively high magnetic moment material layer 52 as shown in FIG. 2B. In a particular application of the present invention, the substrate 50 may comprise a shared shield with an overlying write gap material on which the MR or GMR writer is formed. The relatively high magnetic moment material layer 52 may, in a preferred embodiment, be formed in a conventional sputtering operation utilizing cobalt-zirconium-tantalum (CoZrTa), iron-aluminum-nitride (FeAlN), iron-tantalum-nitride (FeTaN), iron-nitride (FeN) or other similar materials. As shown in the following FIG. 2C, a photoresist area 54 is then patterned on the exposed surface of the relatively high magnetic moment material layer 52 to subsequently define the pole of the magnetic recording head.