Method and apparatus for controlling plating over a face of a substrate

A plating system comprising:

• a tank for containing a planting solution;
• a shaft extending into the tank, the shaft and the tank being rotatable relative to one another;
• a substrate holder mounted to the shaft, the substrate holder being configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank,
• an inlet port for allowing the plating solution onto the first face of the substrate, an outlet for allowing the plating solution out of the tank;
• and
• a temperature control device which creates a temperature gradient over a second face of the substrate opposing the first face, and
• wherein the temperature control device includes at least first and second thermal bladders locatable on the second face, each bladder having an inlet opening for allowing a temperature control medium into the bladder and an outlet opening for allowing the temperature control medium out of the bladder.

A method of plating on a substrate, the method comprising:

• exposing in a tank at least a first face of the substrate to a plating solution in the tank;
• rotating the substrate relative to the plating solution;
• directing flow within the tank of the plating solution onto a first region of the first face of the substrate, from where the plating solution flows over a second region of the first face of the substrate, wherein the substrate is rotated about the first region;
• and
• creating a temperature gradient over the first face of the substrate.