Electroplating of semiconductor wafers
AssigneeApplied Materials, Inc.
InventorNicolay Kovarsky
Life of this patent
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Abstract
An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.
Claims18
A method of electro-chemical deposition comprising:
- flowing an electrolyte into a housing to a level that covers a substrate supported within the housing;
- introducing a second fluid below the substrate to displace a portion of the electrolyte from the housing prior to electrically biasing the substrate thereby creating a floating layer of electrolyte surrounding the substrate;
- and
- electrically biasing the substrate in the floating layer of electrolyte.
A method of electro-chemical deposition on a substrate, comprising:
- sealing the substrate within a housing with a first lid;
- flowing an electrolyte into the housing;
- applying a bias to the substrate;
- removing the first lid and sealing the substrata within the housing with a second lid;
- and
- displacing the electrolyte with a heavy immiscible liquid flowing into the housing.
A method of electro-chemical deposition on a substrate, comprising
- supporting a substrate on a substrate support within a housing;
- covering the supported substrate with electrolyte;
- rotating the drive plate;
- and
- electrically biasing the substrate.
A method for electrochemically depositing a conductive surface on a substrate, comprising:
- supporting the substrate on an upwardly facing substrate support in a housing having an anode above the substrate;
- flowing an electrolyte into the housing;
- flowing an immiscible liquid having a density greater than the electrolyte into the housing to fill the housing to a level below the upper surface of the substrate support, the total volume of the immiscible liquid and the electrolyte being sufficient that the electrolyte covers the upper surface of the substrate and the lower surface of the anode;
- and
- applying an electrical bias to the substrate support and to the anode, whereby a conductive surface is deposited on the upper surface of the substrate.
A method of electro-chemical deposition comprising:
- flowing an electrolyte into a housing having a substrate supported therein;
- introducing a heavy immiscible liquid into the housing below the electrolyte to a level sufficient to displace the electrolyte upwardly and create a floating layer of electrolyte surrounding the substrate;
- and
- electrically biasing the substrate in the floating layer of electrolyte.
Dependencies are inferred from the claim text.