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US 6,685,796 B1Granted
CMP uniformity
AssigneeInfineon Technologies AG
InventorsChenting Lin, Robert van den Berg, Sumit Pandey
Life of this patent
Estimating the term…
Abstract
Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser that dispenses slurry from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser and wafer to redistribute the slurry also improves the slurry distribution.
Claims18
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- and
- a slurry dispensing system for dispensing slurry onto the polishing pad, the slurry dispensing system comprising a dispenser having a plurality of outlets for dispensing slurry therefrom, the plurality of outlets including at least one individually adjustable outlet for individually controlling the slurry flow rate of said outlet, the dispenser being curved so as to produce a desired slurry distribution.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- and
- a slurry dispensing system for dispensing slurry onto the polishing pad, the slurry dispensing system comprising a dispenser having a plurality of outlets for dispensing slurry therefrom, the plurality of outlets being located along a length of the dispenser and separated from one another at unequal distances so as to produce a desired slurry distribution, the plurality of outlets including at least one individually adjustable outlet for individually controlling the slurry flow rate of said outlet.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- and
- a slurry dispensing system for dispensing slurry onto the polishing pad, the slurry dispensing system comprising a dispenser having a plurality of outlets for dispensing slurry therefrom, the plurality of outlets comprising at least one individually adjustable outlet for individually controlling the slurry flow rate of said outlet.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- and
- a slurry dispensing system for dispensing slurry onto the polishing pad, the slurry dispensing system comprising a plurality of outlets for dispensing slurry therefrom and a plurality of dispensers each having at least one of the plurality of outlets, the plurality of outlets including at least one individually adjustable outlet for individually controlling the slurry flow rate of said outlet.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- a substrate carrier for supporting a substrate;
- a slurry dispenser for dispensing slurry onto the polishing pad;
- and
- an adjustable squeeze bar mount for adjustably supporting a squeeze bar adjacent to a surface of said polishing pad so as to redistribute the slurry and produce a desired slurry distribution on said polishing pad.
2 more elements
Dependencies are inferred from the claim text.