Paste applicator and paste application method for die bonding

A paste applicator for die bonding, said paste applicator applying paste for adhering a semiconductor chip onto a substrate, and said paste applicator comprising:

• an application nozzle having an application opening, said application nozzle dispensing said paste from said application opening to apply said paste to said substrate;
• a transfer table for moving said application nozzle relative to said substrate;
• a dispenser which dispenses said paste to said application nozzle;
• an application volume memory for storing data on application volume of said paste to be applied to said substrate;
• an application pattern data memory for storing data corresponding to a plurality of application patterns for said paste to be applied in an application area of said substrate;
• a chip size data memory for storing chip size data on a size of said semiconductor chip to be bonded;
• an application pattern setting unit for calculating, based on the chip size data stored in said chip size data memory and said plurality of application patterns stored in said application pattern data memory,
• coordinates data c for specifying an application line,
• speed pattern v on a travel oath on which the application nozzle moves on the application line, and
• time t for applying said paste on said travel path;
• a dispensing flow rate calculator for calculating a dispensing flow rate of said dispenser based on the data on application volume in said application volume memory and the data corresponding to a selected one of said patterns in said application pattern data memory;
• a dispenser controller for controlling said dispenser based on the dispensing flow rate calculated by said dispensing flow rate calculator;
• and
• a transfer table controller for controlling said transfer table based on the coordinates data c and the speed pattern v.