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AssigneeChung-Shan Institute of Science and Technology
InventorsJer-Shyong Lai, Wen-Chueh Pan, Yang-Jiann Fann, Yih-Hsing Wang, Chien-Cheng He, Chaug-Liang Hsu
Estimating the term…
A compensating chemical mechanical wafer polishing apparatus and its related polishing method, which makes end point detection easy, minimizes slurry consumption, and requires less installation space and, in which a main polishing head of diameter smaller than the wafer and a compensating polishing head are used to polish the wafer, which is upwardly disposed in contact with the polishing heads. By means of the operation of the compensating polishing head to polish the wafer over the area where the main polishing head cannot effectively evenly polish, satisfactory polishing effect is achieved.
A compensating chemical mechanical wafer polishing apparatus comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
The workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement: in a rotary movement only,…
Control means for lapping machines or devices: devices or means for detecting lapping completion
Devices or means for dressing or conditioning abrasive surfaces: devices or means for dressing, cleaning or otherwise conditioning lapping tools
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents: for feeding of fluid, sprayed, pulverised, or…
Term ended 12 Jun 2022 (estimated)
1. Field of the Invention
The present invention relates to a chemical mechanical wafer polishing technique and, more specifically, to a compensating chemical mechanical wafer polishing apparatus and method, which achieves a satisfactory, smooth polishing effect.
2. Description of the Related Art
FIG. 1 is an elevational view of a compensating chemical mechanical wafer polishing apparatus constructed according to the present invention.
FIG. 2 is an enlarged view of a part of the compensating chemical mechanical wafer polishing apparatus shown in FIG. 1.
FIG. 3 is a schematic drawing showing a polishing status of the present invention.
Referring to FIGS. from 1 through 4, a compensating chemical mechanical wafer polishing apparatus 10 is shown comprising a wafer carrier 11, a polishing module 21, a cleaning module 31, a pad conditional module 41, and a machine table 51.
The wafer carrier 11 comprises a bearing rod 12 supported on a lifting mechanism 13 and lifted to hold a wafer. The face of the wafer carrier 11 provides a vacuum suction function to suck the wafer during polishing.
The polishing module 21 comprises a main polishing head 22, and a compensating polishing head 24. The bottom polishing pad of the main polishing had 22 can be made having a circular, annular, polygonal, or oval shape, or the shape of a three-leaf, four-leaf, five-leaf, or any of a variety of polygonal configurations.