Polishing pad window for a chemical mechanical polishing tool
AssigneeSpeedFam-IPEC Corporation
InventorsClinton O. Fruitman, Mark A. Meloni, Periya Gopalan, Andrew Yednak, III
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AssigneeSpeedFam-IPEC Corporation
InventorsClinton O. Fruitman, Mark A. Meloni, Periya Gopalan, Andrew Yednak, III
Estimating the term…
The present invention is an apparatus and method for manufacturing a window into a polishing pad used during a planarization process of a front surface of a wafer. A hole is created in the polishing pad at a location where a window is desired. A first release film may be pressed against the working surface of the polishing pad thereby covering one end of the hole. Window material of suitable mechanical, chemical and optical properties is cast in the hole. A second release film may also be pressed against the bottom surface of the polishing pad covering the other end of the hole. The window material is preferably cured with light to quickly form and bond the window into the hole. The release films may be removed leaving the cast window in the polishing pad.
A process for creating a window in a polishing pad having a working surface and a bottom surface comprising the steps of:
A process for creating a window in a polishing pad having a working surface and a bottom surface comprising the steps of:
A process for creating a window in a polishing pad having a working surface and a bottom surface comprising the steps of:
An abrasive member for removing material from a workpiece comprising:
An abrasive member for removing material from a workpiece comprising:
An abrasive member for removing material from a workpiece comprising:
An abrasive member for removing material from a workpiece comprising:
An abrasive member for removing material from a workplace comprises:
An abrasive member for removing material from a workplace comprising:
Dependencies are inferred from the claim text.