Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition

A socket for an electronic package having a plurality of terminals comprising:

• a base member formed of electrically insulative material and having a plurality of spaced apart barrel receiving bores extending between a top surface and a bottom surface thereof,
• a plurality of electrical contact probe assemblies, a probe assembly received in each bore, each probe assembly comprising a generally tubular barrel received in a respective barrel receiving bore formed of electrically conductive material having first and second opposite ends and a longitudinal axis, the first end having an electrical contact configuration in engagement with the barrel and extending below the bottom surface of the base member, the second end being open ended and formed with an elongated, reduced diameter portion, a contact tip having an elongated portion at a first end thereof slidably and removably received in the elongated, reduced diameter portion through the open end of the barrel, a second end of the contact tip having a selected contact configuration, a coil spring mounted in the barrel for placing an outward force on the contact tip, the contact tip being slidable inwardly into the barrel against the bias of the coil spring,
• a retainer member mounted on the base member, the retainer member having a plurality of contact tip receiving bores extending between a top surface and a bottom surface thereof and aligned with respective bores in the base member, the bores in the retainer member being formed by a surface which includes a stop surface engageable with a corresponding stop surface of the contact tip to limit outward movement of the contact tip, whereby removal of the retainer member allows the contact tips to be easily removed upon contamination by solder residue and the like.