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US 6,685,440 B2Granted
Methods of pressure fluctuation dampening
AssigneeLam Research Corporation
InventorLarry Ping-Kwan Wong
Life of this patent
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AssigneeLam Research Corporation
InventorLarry Ping-Kwan Wong
Estimating the term…
A pressure booster and method for amplifying a water pressure that is supplied by a water facility is provided. The pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility. Further included is a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure. The pressure dampener also has a dampener output. A pressure regulator having a regulator input for receiving the dampener output is also included as part of the pressure booster. The pressure regulator has a regulator output that is configured to supply an amplified water pressure having a substantially reduced pressure fluctuation, and an adjustment control that is connected to the pressure regulator. The adjustment control is provided to enable precision turning of the pressure fluctuations at the output of the pressure regulator, such that a substantially more stable water supply can be provided to the cleaning system(s) connected to the pressure booster.
A method for dampening fluctuations in water pressure supplied to a wafer cleaning system, the method comprising the operations of:
A method of amplifying a water pressure that is supplied by a water facility to one or more semiconductor substrate cleaning systems, the method comprising the operations of:
A method of amplifying a water pressure that is supplied by a water facility to a semiconductor substrate cleaning system, the method comprising the operations of:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Combating cavitation, whirls, noise, vibration or the like ; Balancing: especially adapted for liquid pumps
Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00:…
Non-positive-displacement pumps
Positive-displacement machines for liquids
Term ended 16 Sep 2021 (estimated)
1. Field of the Invention
This invention relates generally to water pressure regulating devices, and more particularly to systems for dampening water pressure fluctuations in pump systems used to supply fluids to wafer cleaning stations.
2. Description of the Related Art
The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings, and like reference numerals designate like structural elements.
FIG. 1 illustrates a pair of cleaning systems that are connected to a water pressure amplifying system, in accordance with one embodiment of the present invention
FIGS. 2A and 2B show a side view and a top view, respectively, of a wafer cleaning system.
An invention is described for a booster pump that can supply water pressure sensitive cleaning systems with a controlled water pressure flow that has a substantial reduction in pulsating water pressure fluctuations. It will be obvious, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.
FIG. 1 illustrates a pair of cleaning systems being connected to a water pressure amplifying system, in accordance with one embodiment of the present invention. The system includes a booster pump 102, which is connected between a facility water supply 106 and cleaning systems 104a and 104b. The booster pump 102 is also configured to receive a controlling air pressure (Pv) that is provided from a facility air pressure 108. Therefore, in situations where the facility water pressure 106 is below the pressure acceptable for running the cleaning systems 104a and 104b, a booster pump 102 is provided to increase the water pressure in a controlled manner.
As shown, the booster pump 102 is connected to the facility water supply 106 via a connection line 110. The connection line 110 is typically a tubing line that is configured to be connected to an appropriate connector at the facility water supply 106. The booster pump 102 is then configured to produce an amplified pressure 112a and 112b that is approximately the same or slightly greater than the pressure desired by the cleaning system 104a and 104b. In a typical Synergy™ cleaning system from OnTrack™, the desired pressure is about 50±5 PSI. Of course, the lower the pressure swing the better. In this embodiment, the pressure 112 is precision controlled internally to the booster pump 102 to reduce water pressure fluctuations that are common in conventional water pressure amplifying systems.