Printer, printer head and method of producing the print head to promote reliable bonding of print head structures

A printer head used to perform a printing operation by causing ink drops to fly out as a result of driving a heating element, wherein,

• predetermined lamination materials are successively placed upon each other on a semiconductor substrate of a semiconductor device in order to form the heating element, the heating element being formed at a top side of multiple layers of wiring patterns to form a resistance film, a drive circuit which drives the heating element, a wall surface of an ink chamber which holds ink so that the ink is heated by the heating element, and a wall surface of an ink path used to guide the ink to the ink chamber;
• a predetermined plate-shaped material is disposed in order to form the ink chamber, the ink path, and a nozzle, the nozzle being used to guide the ink in the ink chamber to the outside;
• and
• at least one of the lamination materials placed upon each other on the semiconductor substrate is smoothened so that a surface where the plate-shaped material is to be disposed is smooth.

A method of producing a printer head used to perform a printing operation y causing ink drops to fly out as a result of driving a heating, the method comprising:

• a first lamination step in which predetermined lamination materials are successively placed upon each other on a semiconductor substrate of a semiconductor device in order to form the heating element, the method further comprising the step of providing multiple layers of wiring patterns, and wherein the first lamination step comprises forming the heating element at a top side of the wiring patterns at the topmost layer by forming a resistance film, a drive circuit which drives the heating element, a wall surface of an ink chamber which holds ink so that the ink is heated by the heating element, and another wall surface of an ink path used to guide the ink to the ink chamber;
• a second lamination step in which a predetermined plate-shaped material is disposed in order to form the ink chamber, the ink path, and a nozzle, the nozzle being used to guide the ink in the ink chamber to the outside;
• and
• a smoothening step in which at least one of the lamination materials placed upon each other on the semiconductor substrate is smoothened so that a surface where the plate-shaped material is disposed is smooth.

A printer head, comprising:

• a substrate;
• at least one wiring pattern disposed above the substrate;
• at least one insulation layer disposed on top of the at least one wiring pattern, the at least one insulation layer having a smooth surface via a process wherein the smooth surface eliminates irregularities of the at least one wiring pattern;
• a heater element disposed planarly on a top side of the topmost layer of the at least one wiring pattern via the smooth surface to form a resistance film;
• a dry film disposed on top of the heater element;
• and
• an orifice plate disposed on top of the dry film wherein the orifice plate is planarly bonded to the dry film.

A method of manufacturing a printer head, comprising:

• forming a substrate;
• disposing at least one wiring pattern on the substrate;
• disposing a least one insulation layer on the at least one wiring pattern;
• removing irregularities of the at least one wiring pattern by smoothing the at least one insulation layer;
• disposing a heater element on the ton side of the topmost layer of the at least one insulation layer to form a resistance film;
• disposing a dry film on top of the heater element;
• and
• planarly bonding an orifice plate to the dry film.