Surface acoustic wave component
AssigneeEpcos AG
InventorsAlois Stelzl, Hans Krüger, Karl Weidner, Manfred Wossler
Life of this patent
Estimating the term…
Abstract
An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.
Claims7
A surface acoustic wave component comprising:
- a base plate having external electrical terminal elements;
- a chip comprising a piezoelectric substrate having a substrate surface with electrically conductive structures disposed thereon;
- protective film structures being disposed on said substrate surface, said protective film structures building up a protective film cover, said protective film cover having a film surface facing away from said substrate surface;
- a plurality of electric contact elements being disposed on said film surface;
- said electrical contact elements having contact locations;
- said electrically conductive structures being electrically connected to said contact locations by means of bumps;
- said chips being arranged on said base plate with said external electrical terminal elements being electrically connected to said contact locations.
Dependencies are inferred from the claim text.