Ultrasonic vibration mode for wire bonding
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Zhiqiang Wu
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Abstract
A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
Claims11
A method of forming a bond between a wire and a semiconductor device at a bond site thereon, comprising:
- (a) feeding said wire through a capillary having a lumen adapted to receive said wire therethrough such tat a distal end of said wire extends out of a bonding end of said capillary;
- (b) forming a ball on said distal end of said wire;
- (c) bringing said ball into contact with said semiconductor device at said bond site;
- (d) generating ultrasonic vibration energy;
- (e) applying a first portion of said ultrasonic vibration energy directly to said capillary in a first direction;
- (f) redirecting a second portion of said ultrasonic vibration energy along a medium capable of transmitting said ultrasonic vibration energy;
- (g) applying said second portion of said ultrasonic vibration to said capillary in a second direction different than said first direction.
A method of bonding a wire to a bond pad on a substrate, comprising:
- (a) forming a ball on a distal end of said wire;
- (b) pressing said ball against said bond pad with a capillary element;
- and
- (c) applying ultrasonic vibration energy to said capillary to cause ultrasonic vibration of said capillary in a substantially circular or elliptical mode;
- wherein said step (e) comprises:
- (c)(1) applying a first portion of ultrasonic vibration energy directly to said capillary in a first direction;
- and
- (c)(2) applying a second portion of ultrasonic vibration energy to said capillary via a wave-propagating arm such that said second portion is applied to said capillary in a second direction different than said first direction.
Dependencies are inferred from the claim text.