Temperature regulator for a substrate in vapor deposition processes

Abstract

A heat transfer regulating mixture having a metallic component A with a melting point TA and a particulate ceramic component B which is non-wettable by the metallic component A, non-reactive therewith and which has a melting temperature TB which is higher than both the temperature TA and a desired operating temperature TD which is also higher than TA. The metallic component A and the particulate ceramic component B and the respective amounts will typically be selected to have a higher thermal resistivity above TA than below TA. The heat transfer regulating mixture may be incorporated in the heat transfer regulating device having the mixture within an enclosure having first and second contact faces.

Dependencies are inferred from the claim text.