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US 6,684,699 B1Granted
Micromechanical device
AssigneeSensonor ASA
InventorsDaniel Lapadatu, Terju Kvisteroy, Henrik Jakobsen
Life of this patent
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Abstract
A pedestal structure and its fabrication method stress release assembly of micromechanical sensors, in particular acceleration sensor, angular rate sensors, inclination sensors or angular acceleration. At least one silicon seismic mass is used as sensing element. The at least one silicon seismic mass is joined to the silicon frame via at least one assembly pedestal, the surface of which is bonded to a covering wafer, either glass or silicon.
Claims18
A micromechanical device, comprising:
- a semiconductor wafer structured to form a support wall and a pedestal member connected to and extending from the support wall, wherein the pedestal member defines an inner end portion that is connected to the support wall and an outer end portion, spaced from the inner end portion, that is not connected to the support wall;
- a first encasing member located adjacent the semiconductor wafer;
- a second encasing member spaced from the first encasing member and located adjacent the semiconductor wafer;
- wherein the pedestal member is bonded to only the first encasing members and is not bonded to the second encasing member;
- wherein the pedestal member defines an outer periphery and includes a rim formed around at least a portion of the outer periphery, wherein the rim is located on at least the outer end portion of the pedestal member and is spaced from the first and second encasing members;
- and
- at least one sensing component supported by the rim of the pedestal member, wherein the sensing component is interconnected with the rim of the pedestal member toward the outer end portion of the pedestal member.
4 more elements
A micromechanical device, comprising:
- a semiconductor wafer structured to form a support wall and a pedestal member, wherein the support wall defines a boundary of a space, and wherein the pedestal member defines an inner area connected to the support wall and an outer area located outwardly of the support wall that extends into the space, wherein the outer area of the pedestal member is not interconnected with the support wall;
- a first encasing member located adjacent the semiconductor wafer;
- a second encasing member spaced from the first encasing member and located adjacent the semiconductor wafer;
- wherein the pedestal member is bonded to only the first encasing members and is not bonded to the second encasing member;
- and
- a sensing component interconnected with and supported by the outer area of the pedestal member, wherein the sensing component is arranged so as to be spaced from the first and second encasing members.
3 more elements
Dependencies are inferred from the claim text.