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US 6,684,523 B2Granted
Particle removal apparatus
AssigneeApplied Materials, Inc.
InventorsJoel Brad Bailey, Reginald W. Hunter, Steven Gianoulakis
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsJoel Brad Bailey, Reginald W. Hunter, Steven Gianoulakis
Estimating the term…
Embodiments of the invention generally provide an apparatus for removing particles from a substrate surface, wherein the apparatus includes a substrate support member configured to support a substrate thereon, and a broadband actuator in mechanical communication with the substrate support member. Additionally, an air knife assembly may be positioned proximate a perimeter of the substrate surface, and is configured to deliver a laminar stream of air across the substrate surface in order to remove the dislodged contamination particles therefrom. Alternatively, a plasma source may be used to remove dislodged particles from the area proximate the substrate surface.
An apparatus for removing particles from a substrate surface, comprising:
A particle removal chamber, comprising:
A particle removal chamber, comprising:
A particle removal chamber, comprising:
A processing chamber for removing particles from a substrate surface, comprising:
A processing chamber for removing particles from a substrate surface, comprising:
A processing chamber for removing particles from a substrate surface, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
The wafers being placed on a susceptor, stage or support: characterised by a plurality of individual support members, e.g. support posts or…
Cleaning by methods not provided for in a single other subclass or
Apparatus for manufacture or treatment: apparatus for fluid treatment
For etching: for drying etching
Term ended 6 Dec 2021 (estimated)
1. Field of the Invention
The present invention generally relates to an apparatus and method for removing particles from substrates.
2. Background of the Related Art
FIG. 1 illustrates a conventional substrate cleaning apparatus.
FIG. 2 illustrates a perspective view of an exemplary processing system incorporating the cleaning apparatus of the invention.
FIG. 3 illustrates an embodiment of a simplified particle removal chamber of the invention.
A. Overall System Configuration
FIG. 2 illustrates one embodiment of a processing system 200 according to aspects of the invention. System 200 includes a factory interface 201 having at least one substrate processing chamber 202a, 202b attached thereto. Factory interface 201 generally operates to transfer substrates from substrate pods seated on pod loaders 222 through an atmospheric pressure clean environment/enclosure 203 to a processing chamber 202a, 202b. The clean environment in enclosure 203 is generally provided through air filtration processes, such as, HEPA filtration, for example. Factory interface 201 may also include a substrate orienter/aligner 224 that is used to properly align the substrates prior to processing. Substrate aligner 224 may be located in a small side chamber 226 attached to factory interface 201, or alternatively, orientor 224 may be positioned within enclosure 203 of factory interface 201 itself. At least one substrate transfer robot 228 is positioned in enclosure 203 to transport substrates between various positions/locations within enclosure 203, and to other locations in communication therewith. Robot 228 may be configured to travel along a track system within enclosure 203 from a first end 260 to a second end 262 of chamber 203 in the directions indicated by arrows “E” and “B”. Alternatively, two robots 229 may be fixedly positioned in enclosure 203 to transfer substrates between select groups of chambers or other areas in communication with enclosure 203.
Processing chambers 202a, 202b may be a combination of cleaning chambers, metrology/inspection chambers, and/or other chambers used in substrate processing. For example, chambers 202b may be metrology/inspection chambers, while chambers 202a may be cleaning chambers. Metrology/inspection chambers; as used herein, generally refers to a chamber that is used to detect particles on a substrate or to measure the integrity of devices formed on the substrate. Cleaning chambers, as used herein, generally refers to chambers used to remove particles from substrate surfaces. In configurations using a metrology/inspection chamber 202b, substrates may be examined in metrology/inspection chambers 202b before and/or after being processed in one of cleaning chambers 202a. In configurations using a metrology/inspection chamber 202b, robot 228 may first position substrate 229 in the metrology/inspection chamber 202b for analysis of the substrate and any particles residing thereon. The analysis of the substrate and particles thereon may be controlled, for example, by a microprocessor controller configured to receive input from measuring devices in chamber 202b and output control signals based upon the inputs. The analysis of substrate 229 by metrology/inspection chamber 202b may then be used to calculate parameters used in the cleaning process. Alternatively, the metrology/inspection chamber may be used to check substrates for particles after a cleaning process is complete, and therefore, determine if additional cleaning of the substrate is necessary