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US 6,684,490 B2Granted
Nozzle rotating apparatus of module head in surface mounting device
AssigneeMirae Corporation
InventorsJang Sung Chun, Do Hyun Kim, Ji Hyun Hwang
Life of this patent
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AssigneeMirae Corporation
InventorsJang Sung Chun, Do Hyun Kim, Ji Hyun Hwang
Estimating the term…
A nozzle rotating apparatus of a module head of a surface mounting device is capable of correcting an error occurring when a nozzle picks an electronic component and places it on a printed circuit board. The nozzle rotating apparatus of a module head of a surface mounting device for picking up an electronic component and placing it at a predetermined position, includes: a head movable in a predetermined direction along an upper portion of a substrate and having at least one shaft; a driving means for driving the head; a nozzle mounted at a lower predetermined portion of the head to pick up and place the electronic component; pinions installed at the outer periphery of the shaft installed at a predetermined portion of the head; a rack engaged with the pinions; and a driving force transmitting means for moving the rack to a predetermined direction.
A nozzle rotating apparatus of a module head of a surface mounting device for picking up an electronic component and placing it at a predetermined position, comprising:
A nozzle rotating apparatus of a module head of a surface mounting device, comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Pick-and-place heads or apparatus, e.g. with jaws: with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g.…
Incorporating a pick-up tool: having multiple pick-up tools
Means to assemble electrical device: means to fasten electrical component to wiring board, base, or substrate
Means to fasten electrical component to wiring board, base, or substrate: chip component
Term ended 14 Dec 2021 (estimated)
1. Field of the Invention
The present invention relates to a nozzle rotating apparatus of a module head of a surface mounting device, and more particularly to a nozzle rotating apparatus of a module head of a surface mounting device which is capable of correcting an error possibly occurring when a nozzle picks up an electronic component and places it on a printed circuit board.
2. Description of the Background Art
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
In the drawings:
FIG. 1 is a plan view of a module head of a surface mounting device adopting a nozzle rotating apparatus in accordance with a conventional art;
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
FIG. 3 is a plan view of a module head of a surface mounting device adopting a nozzle rotating apparatus in accordance with the present invention, FIG. 4 is a side view of the module head of FIG. 1 in accordance with the present invention, and FIG. 5 is a perspective view of the nozzle rotating apparatus, a major part in accordance with the present invention.
As shown in the drawings, referring to a head 10 adopted to the present invention, a plurality of shafts 11 are installed at a predetermined portion at the inner side of the head 10, and a plurality of nozzles 11a are installed at a predetermined portion at the lower side of the shafts 11.