Loading patent…
AssigneeInternational Business Machines Corporation
InventorsKrishna G. Sachdev, Michael Berger, Rebecca Y. Gorrell, Gregg B. Monjeau, Bernadette H. Perry, Thomas A. Wassick
Estimating the term…
Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.
A solvent-free, radiation-curable composition comprising a polymer binder, which is a reactive pre-formed thermoplastic or elastomeric polymer/oligomer having reactive functional groups, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent and wherein the composition including the reactive functional groups of the polymer/oligomer is polymerized to form a cured matrix.
A method for repairing and/or fabricating electronic components comprising the steps of:
Dependencies are inferred from the claim text.