Molding apparatus for molding light emitting diode lamps
AssigneeAgilent Technologies, Inc.
InventorsThomas Kheng Guan Peh, Chien Chai Lye
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Abstract
The present invention provides a method and system for molding light emitting diode (LED) lamps. A mold frame is provided around each LED chip in an array. A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip. The first mold insert is removed. A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip.
Claims4
A system for molding light emitting diode lamps using light emitting diode (LED) chips comprising:
- a mold frame;
- a first mold insert locatable in the mold frame, the first mold insert defining first mold voids locatable about the LED chips;
- a second mold insert locatable in the mold frame, the second mold insert defining second mold voids;
- and
- an injector;
- wherein the injector injects light converting material into the first mold voids and injects lens material into the second mold voids.
Dependencies are inferred from the claim text.