Automatic separator and method to obtain circuits for microelectronics
AssigneeNone recorded
InventorGisulfo Baccini
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AssigneeNone recorded
InventorGisulfo Baccini
Estimating the term…
Automatic separator to separate the supporting sub-layer from the print support in work elements for microelectronics and method to realize such separation. The automatic separator comprises a pick up plate provided with depression-type elements for picking up the print support. The pick up plate is movable from a first position in which each print support is stored together with the associated supporting sub-layer to a second position wherein each print support is positioned without the associated supporting sub-layer for a subsequent manufacturing phase. The pick up plate during its movement bring the supporting sub-layer in contact with stationary detachment elements which cause the separation of the supporting sub-layer from the related print support.
A device to separate a print support, usable in microelectronics or for manufacturing multi-layer electronic circuits, from its associated supporting sub-layer, wherein said print support and the associated supporting sub-layer form a work element and wherein said print support is able to be moved from a first position in which it is stored together with the associated supporting sub-layer to a second position wherein it is positioned without the associated supporting sub-layer for a subsequent manufacturing phase, said device comprising pick up means having depression-type means for selectively picking up said print support in said first position and a plate having at least advancing head means and a tail part in order to maintain motion, wherein moving means is provided for moving said pick up means from said first position to said second position along a defined path, and wherein detachment means is disposed along said defined path, in an intermediate position between said first position and said second position for contacting said supporting sub-layer and causing the removing thereof from said print support during the movement of said pick up means from said first position to said second position.
A device to separate a print support, usable in microelectronics or for manufacturing multi-layer electronic circuits, from its associated supporting sub-layer, wherein said print support and the associated supporting sub-layer form a work element and wherein said print support is able to be moved from a first position in which it is stored together with the associated supporting sub-layer to a second position wherein it is positioned without the associated supporting sub-layer for a subsequent manufacturing phase, said device comprising pick up means having depression-type means for selectively picking up said print support in said first position, wherein moving means is provided for moving said pick up means from said first position to said second position along a defined path, and wherein detachment means in the form of an adhesive member is disposed along said defined path, in an intermediate position between said first position and said second position for contacting said supporting sub-layer and causing the removing thereof from said print support during the movement of said pick up means from said first position to said second position, and wherein a stationary element cooperates with said adhesive member to detach said supporting sub-layer from said adhesive member.
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
The present invention concerns an automatic separator to separate a print support from the related supporting sub-layer wherein the print support is normally constituted by a base material used to print circuits in microelectronics and to make up multi-layer circuits.
An example of this print support is typically the so called green tape, which is a Du Pont® trade mark and material. However, there are other materials in the state of the art which perform the same functions or analogous functions.
The present invention also concerns the method to obtain circuits for microelectronics on a print support.
We shall now see the invention, in some of its variants, with the help of the attached diagrams, given as a non-restrictive example, wherein:
FIG. 1 shows the detachment of the supporting sub-layer, in movement, with a roller;
FIG. 2 shows the system of FIG. 1 with a view from A;
FIGS. 1 and 4-7 show a work element 10 consisting of a print support 11 and a related supporting sub-layer 12. The work element 10, complete with holes and printed circuits on the support 11 is positioned in a first position, here schematically represented by a store 13 or by any other means coherent with the manufacturing steps upstream.
The work element 10, when it is in the first position, is already cut from an original roll, not shown in the drawings, and subjected to all the necessary manufacturing steps of holing, printing, shaping, handling, storing and any other steps needed for the specific purpose.
The work element 10 is subjected to the whole work cycle with the print support 11 having been combined with the relative supporting sub-layer 12.
Apparatus for manufacture or treatment: apparatus for mechanical treatment or grinding or cutting
Apparatus or processes for manufacturing printed circuits
For supporting or gripping: using temporarily an auxiliary support
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass
Term ended 16 Apr 2022 (estimated)