Heatspreader for a flip chip device, and method for connecting the heatspreader
AssigneeAgere Systems Inc.
InventorsDavid Lischner, Raymond J. Nika, James Robert Ronemus
Life of this patent
Estimating the term…
Abstract
A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of metal. The heatspreader has a heatspreader plate and a plurality of legs. The legs are flat plate portions substantially parallel to the heatspreader plate. A first thermal interface material is used to connect the heatspreader plate to a non-active side of the integrated circuit device. A second thermal interface material is used to connect each of the plurality of legs to the substrate.
Claims6
A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration, comprising the steps of:
- (a) forming a heatspreader from a single flat sheet of metal, the heatspreader having a heatspreader plate and a plurality of legs, the legs being flat plate portions substantially parallel to the heatspreader plate;
- (b) using a first thermal interface material to connect the heatspreader plate to a non-active side of the integrated circuit device;
- and
- (c) using a second thermal interface material to connect each of the plurality of legs to the substrate.
Dependencies are inferred from the claim text.