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AssigneeMicron Technology, Inc.
InventorsLarry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
Estimating the term…
A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.
An apparatus for installing an electronic circuit device on a support, the support having a plurality of first conductive elements and the device having a plurality of second conductive elements disposed adjacent to at least one edge thereof, the first conductive elements being configured to contact the second conductive elements when the device is installed on the support, the apparatus comprising:
A tool system for installing a semiconductor device on a receiving support, the device including a plurality of conductive elements disposed adjacent to an edge thereof, the conductive elements being received by an interface region of the support, the tool system comprising:
An apparatus for installing an electronic circuit device on a support, the support having a plurality of first conductive elements and the device having a plurality of second conductive elements disposed adjacent to at least one edge thereof, the first conductive elements being configured to contact the second conductive elements when the device is installed on the support, the apparatus comprising:
A tool system for installing a semiconductor device on a receiving support, the device including a plurality of conductive elements disposed adjacent to an edge thereof, the conductive elements being received by an interface region of the support;
Dependencies are inferred from the claim text.