US 6,681,463 B2Granted

Manufacturing method of piezoelectric components

AssigneeMurata Manufacturing Co., Ltd.

InventorNobuyuki Hori

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Abstract

A method for manufacturing piezoelectric components involves using a plurality of divided hard masks to form a highly accurate electrode pattern without degradation of electrical characteristics while increasing mask strength. The method is for forming vibration electrodes, terminal electrodes, and lead electrodes for connecting the vibration and terminal electrodes on a piezoelectric substrate and includes the step of preparing a first hard mask having openings corresponding to the vibration electrode and lead electrodes and a second hard mask having openings corresponding to the terminal and lead electrodes. The first and second hard masks are arranged such that the openings of the first and second hard masks are partially overlapped, and the overlapped portion is located at a position that is spaced from the vibration electrode by at least about three times the thickness of the piezoelectric substrate.

Claims20

Dependent claims

A method for manufacturing piezoelectric components, in which a vibration electrode, terminal electrodes, and lead electrodes for connecting the vibration electrode to the terminal electrodes are formed on a piezoelectric substrate by a thin-film deposition technique, the method comprising the steps of:

preparing a first hard mask having openings corresponding to the vibration electrode and lead electrodes;
preparing a second hard mask having openings corresponding to at least the terminal electrodes;
continuously forming the vibration electrode and lead electrodes by the thin-film deposition technique while arranging the first hard mask on the piezoelectric substrate;
and
forming at least the terminal electrodes by the thin-film deposition technique while arranging the second hard mask on the piezoelectric substrate;
wherein
the first and second hard masks are arranged such that the openings of the first and second hard masks are partially overlapped to form an overlapped portion, and the overlapped portion is located at a position on one of the lead electrode and the terminal electrode, the position being spaced from the vibration electrode by at least about three times the thickness of the piezoelectric substrate.

4 more elements

A method for manufacturing piezoelectric components including a vibration electrode, terminal electrodes, and lead electrodes to connect the vibration electrode to the terminal electrodes provided on a surface of a piezoelectric substrate, the method comprising the steps of:

providing a first hard mask having openings corresponding to the vibration electrode and at least a portion of the lead electrodes;
providing a second hard mask having openings corresponding to at least the terminal electrodes;
placing the first hard mask on the surface of the piezoelectric substrate;
forming the vibration electrode and at least the portion of the lead electrodes on the surface of the piezoelectric substrate;
placing the second hard mask on the surface of the piezoelectric substrate;
and
forming at least the terminal electrodes on the surface of the piezoelectric substrate;
wherein
the first and second hard masks are arranged such that the openings of the first and second hard masks are partially overlapped to form an overlapped portion, and the overlapped portion is located at a position on one of the lead electrode and the terminal electrode, the position being spaced from the vibration electrode by at least about three times the thickness of the piezoelectric substrate.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/132,282Filed 26 Apr 2002
Priority: JP 2001-15421323 May 2001
Published: US 2002/0175601 A128 Nov 2002
Granted: 27 Jan 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H03H 9/564
Monolithic crystal filters: implemented with thin-film techniques
H03H 3/02
For the manufacture of electromechanical resonators or networks: for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/132
For networks consisting of piezoelectric or electrostrictive materials: characterized by a particular shape
Y10T 29/42
Metal working: piezoelectric device making