Small scale chip cooler assembly

A microscale cooling system comprising:

• a thermally insulative housing having an inlet port and an outlet port;
• a capillary passage formed downstream of said inlet port within said housing;
• a thermally conductive element connected to said housing, said thermally conductive element forming with said housing a pool boiling chamber;
• and
• a plurality of thermally conductive projections mounted to said thermally conductive element and extending into said pool boiling chamber wherein heat transferring fluid is throttled in said capillary passage and absorbs heat in said pool boiling chamber.

A microscale cooling system comprising:

• a housing formed of thermally insulative materials;
• a thermally conductive structure connected to said housing, said thermally conductive structure forming with said housing a chamber;
• and
• a single capillary passage formed in said housing and in communication with said chamber;
• and wherein
• said thermally conductive structure includes an outer surface for connecting to a heat generating device;
• said thermally conductive structure includes a plurality of projections;
• and
• said chamber is a pool boiling chamber.

A microscale cooling system comprising:

• a first housing layer of thermally insulative material having a first portion and a second portion;
• an exposed elongated fluid passage formed in said first portion of said first housing layer;
• a second housing layer of thermally insulative material having an inlet port, an outlet port, a mating surface and an absence of an elongated fluid passage, said mating surface of said second housing layer being attached to said first portion of said first housing layer for enclosing said elongated fluid passage to form a capillary of predetermined cross section and length;
• a third layer formed of thermally conductive material attached to said second portion of said first housing layer and forming with a wall of said first housing layer a chamber, said third layer having first and second surfaces;
• a plurality of small, cross-sectioned projections extending from said first surface of said third layer into said chamber constructed to engage a fluid flowing from said capillary wherein heat is transferred from said projections to said fluid;
• and
• a fourth layer of thermally conductive material attached to said second surface of said third layer for connecting a heat generating electronic device to said third layer.