Defect inspection method and apparatus therefor
AssigneeHitachi, Ltd.
InventorsShunji Maeda, Kenji Oka, Hiroshi Makihira, Yasuhiko Nakayama, Minoru Yoshida, Yukihiro Shibata, Chie Shishido
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsShunji Maeda, Kenji Oka, Hiroshi Makihira, Yasuhiko Nakayama, Minoru Yoshida, Yukihiro Shibata, Chie Shishido
Estimating the term…
A pattern inspection method and apparatus in which an image of a first pattern formed on a sample and an image of a second pattern formed on the sample is detected. At least one of the first pattern image and the second pattern image is converted to a gray level so as to be substantially the same with each other by linear combination including a gain and offset. A defect of the sample is detected by using the first pattern image and the second pattern image at least one of which has been converted to the gray level and a result of the detection is outputted to an external storage or processor by a communication arrangement.
A pattern inspection method, comprising the steps of:
A pattern inspection method, comprising the steps of:
A pattern inspection system, comprising:
A pattern inspection system, comprising:
Dependencies are inferred from the claim text.