Mobile telephone device with passive integrated module
AssigneeKoninklijke Philips Electronics N.V.
InventorsRainer Kiewitt, Mareike Katharine Klee, Pieter Willem Jedeloo
Life of this patent
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Abstract
A mobile telephone device fitted with a transmitter and a receiver each having a high-frequency component with an integrated decoupling capacitor. The high-frequency component includes a substrate with the decoupling capacitor on one surface thereof, first and second current supply terminals for the capacitor on the same surface of the substrate as the capacitor, one capacitor electrode connected to a high frequency circuit and a DC voltage source, also on the one surface of the substrate, and the other capacitor electrode connected to ground.
Claims23
A mobile telephone device comprising:
- a transmitter and a receiver, each of which comprise a high-frequency integrated circuit component, wherein the high-frequency integrated circuit component comprises;
- a high-frequency circuit, a DC source, and a decoupling capacitor all integrated together on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground.
A high-frequency component which comprises:
- a high-frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground.
The high frequency component as claimed in claimed 11 wherein the dielectric is sandwiched between the first and second electrodes on one surface of the common substrate, and further comprising a conductor track in said common plain and interconnecting the high frequency circuit, the first current supply terminal and the DC source.
A high-frequency component, which comprises:
- a high-frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground, and the dielectric is sandwiched between the first and second electrodes on one surface of the common substrate, and further comprising a conductor track overlying the substrate and interconnecting the high-frequency circuit, the first current supply terminal and the DC source.
A high-frequency component, which comprises:
- a high frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground, and the dielectric is sandwiched between the first and second electrodes on one surface of the common substrate, and further comprising;
- a protective layer over the second electrode and over the entire surface of the common substrate and with a hole therein having a conductive material for electrically contacting the second electrode to the first current supply terminal, and wherein
- the first current supply terminal, the high-frequency circuit and the DC source lie in a plane overlying the protective layer.
A high-frequency component, and which comprises:
- a high-frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground, wherein the first and second current supply terminals are positioned relative to one another so as to produce, in the vicinity of the integrated decoupling capacitor, opposed magnetic fields that effectively reduce the inherent inductance of the decoupling capacitor in a manner so as to increase the CPU ratio thereof.
A high-frequency component, which comprises:
- a high-frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground, and further comprising:
- a protective layer over the second electrode and over the entire surface of the common substrate,
- first and second conductor tracks, and wherein
- the first and second current supply terminals, the high-frequency circuit, the DC source and the first and second conductor tracks all lie in a plane overlying the protective layer, and
- the first conductor track interconnects the high-frequency circuit, the first current supply terminal and the DC source and the second conductor track connects the second current supply terminal to ground.
A mobile telephone device, comprising:
- a transmitter and a receiver, each of which comprise a high-frequency component, wherein the high-frequency component comprises;
- a high-frequency circuit, a DC source, and an integrated decoupling capacitor on a common substrate, wherein the decoupling capacitor comprises a first electrode, a dielectric, a second electrode, and a first and a second current supply terminal on one and the same side of the decoupling capacitor, and wherein one electrode is connected to the high-frequency circuit and the DC source and the other electrode is connected to ground, and the dielectric is sandwiched between the first and second electrodes on one surface of the common substrate, and further comprising
- a conductor track overlying the substrate and interconnecting the high-frequency circuit, the first current supply terminal and the DC source.
Dependencies are inferred from the claim text.