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US 6,674,178 B1Granted
Semiconductor device having dispersed filler between electrodes
AssigneeNEC Electronics Corporation
InventorGorou Ikegami
Life of this patent
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Abstract
In a semiconductor device, a semiconductor pellet having bump electrodes and a interconnection board having pad electrodes are brought into mutual opposition with a resin containing a filler therebetween, so that the bump electrode and the pad electrodes are superposed. With the filler remaining at the superposed parts between the electrodes, the electrode superposed parts are hot-pressed, and the semiconductor pellet and interconnection board are adhered by the resin.
Claims13
A semiconductor device comprising:
- a semiconductor pellet having bump electrodes;
- an interconnection board having pad electrodes;
- and
- a resin in which is dispersed a filler, said filler being an insulator;
- wherein said bump electrode and said pad electrode are positioned so as to be mutually opposing, with said resin into which a filler is dispersed interposing therebetween, and with said filler remaining at a superposition boundary portion formed between said electrodes, a superposition part being connected by hot pressing, so that the semiconductor pellet and the interconnection board are adhered by said resin,
- wherein there is filler dispersed in a region located at a part of the superposition boundary portion of the superposition part that is 10% or more of an area of the superposition boundary portion of the superposition part, and
- wherein, within the region, a sum of cross-sectional areas of each filler is 10% or less of an area of the region.
4 more elements
A semiconductor device comprising:
- a semiconductor pellet having a plurality of bump electrodes;
- an interconnection board having a plurality of pad electrodes;
- and
- a resin in which filler in which filler is dispersed, said filler being an insulator,
- wherein said plurality of bump electrodes and said plurality of pad electrodes are positioned to be mutually opposing, with resin therebetween at a boundary between each bump electrode and each pad electrode, each respective opposing pair of a bump electrode and a pad electrode forming a superposed part, whereby the plurality of bump electrodes and the plurality of pad electrodes form a plurality of superposed parts,
- wherein the semiconductor pellet and the interconnection board are adhered to each other by said resin,
- wherein at the boundary between the bump electrodes and the pad electrodes, the filler dispersed in the resin exists in the resin of 50% or more of the plurality of superposed parts, a remainder of superposed parts having the resin without filler,
- wherein, for those superposed parts having filler, filler is dispersed within, and localized to, an area that is 10% or more of an area of the boundary within a respective superposed part,
- wherein, within the localized area of a respective superposed part having filler, a sum of cross-sectional areas of each filler is 10% or less of the localized area.
6 more elements
Dependencies are inferred from the claim text.