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US 6,674,173 B1Granted
Stacked paired die package and method of making the same
AssigneeAptos Corporation
InventorTsing-Chow Wang
Life of this patent
Estimating the term…
Abstract
A semiconductor die package design incorporating at least a pair of functional semiconductor dies. The input/output pads locations on one of the dies (the daughter die) are located at the near mirror image of the original die (mother die). The package architecture includes two dies back-to-back or stacked dies back-to-back, therefore a plurality of input/output interconnections can be formed. The package increases density and performance by twofold or more compared to a regular package containing only one die with the same footprint. At least one additional pin can be dedicated as the chip select pin for the daughter die or multiple dies. The other pins can be shared with the mother die.
Claims34
A product comprising:
- a mother die having a top face and a bottom face, and a first side edge and a second side edge, the top face including a plurality of bond pads including a first series of the bond pads located near a first side edge of the mother die and wherein a first bond pad of the first series is connected to a first circuit of the mother die;
- a daughter die having a top face and a bottom face, and a first side edge and the second side edge, the top face including a plurality of bond pads including a first series of bond pads located near the second side edge, and further comprising an electrical redistribution trace connected to a first bond pad of the bond pads of the first series of the daughter die, and wherein the daughter die includes a first circuit that is identical to the first circuit of the mother die and wherein the first bond pad of the first series of bond pads of the daughter die is electrically connected to the first circuit of the daughter die;
- a lead frame comprising a top face and a bottom face and a plurality of leads along a first side including a first lead;
- the mother die being connected to the top face of the lead frame and wherein the first series of bond pads of the mother die are located near the plurality of leads of the lead frame, and the daughter die being connected to the bottom face of the lead frame and wherein the first series of bond pads on the mother die are positioned near the plurality of leads of the lead frame;
- the bond pad of the mother die that is electrically connected to the first circuit of the mother die being electrically connected to the first lead, and the bond pad of the daughter die that is electrically connected to the first circuit of the daughter die being electrically connected to the first lead.
2 more elements
A product comprising:
- a mother die having a top face and a bottom face, and a first side edge and a second side edge, and including a first circuitry, the top face including a plurality of bond pads including a first series of the bond pads located near a first side edge of the mother die and wherein each of the bond pads of the first series is connected to a portion of the first circuitry of the mother die;
- a daughter die having a top face and a bottom face, and a first side edge and the second side edge, and a first circuitry that is identical to the first circuitry of the mother die, the top face including a plurality of bond pads including a first series of bond pads located near the second side edge, and further comprising an electrical redistribution trace connected to each one of the bond pads of the first series of the daughter die;
- a lead frame having a top face and a bottom face and a plurality of leads including a first select pin lead and a second select pin lead;
- the mother die being connected to the top face of the lead frame and wherein the first series of bond pads of the mother die are located near the plurality of leads of the lead frame, and the daughter die being connected to the bottom face of the lead frame and wherein the first series of bond pads on the mother die are positioned near the plurality of leads of the lead frame;
- wherein one of the bond pads of the first series of bond pads of the mother die is electrically connected to the first select pin lead without any other bond pads being electrically connected to the first select pin lead, and wherein one of the bond pads of the first series of bond pads of the daughter die is electrically connected to the second select pin lead without any other bond pads being connected to the second select pin lead, and wherein one of the bond pads of the first series of bond pads of the mother die is connected to a second lead of the lead frame and wherein one of the bond pads of the first series of bond pads of the daughter die is electrically connected to the second lead of the lead frame.
2 more elements
A product comprising:
- a first mother die having a top face and a bottom face, and a first side edge and a second side edge, the top face including a plurality of bond pads including a first series of bond pads located near the first side edge of the first mother die, and the first series of bond pads including a first bond pad and other bond pads, and wherein each of the bond pads of the first series of bond pads is connected to a portion of a first circuitry of the first mother die;
- a first daughter die having a top face and a bottom face, and a first side edge and a second side edge, the top face including a plurality of bond pads including a first series of bond pads located near the second edge of the daughter die, and further comprising electrical redistribution traces each one being individually connected to a respective bond pad of the first series of the daughter die and each electrical trace being connected to a first circuitry of the daughter die that is identical to the first circuitry of the mother die and so that the bond pads of the daughter die are positioned at a location that is the near mirror image of the bond pads on the first mother die;
- a lead frame having a top face and a bottom face, and a plurality of leads including a first select pin lead and a second select pin lead;
- the first mother die being connected to the top face of the lead frame and wherein the first series of bond pads of the mother die are located near the plurality of leads of the lead frame, and the daughter die being connected to the bottom face of the lead frame and wherein the first series of bond pads of the daughter die are positioned near the plurality of leads of the lead frame, and wherein the first bond pad of the first series of bond pads of the mother die is connected to the first select pin lead and wherein the first bond pad of the first series of bond pads of the daughter die is connected to the second select pin lead, and wherein each one of the other bond pads of the first series of bond pads of the first mother die is individually electrically connected to a respective lead of lead frame and wherein the respective lead is also shared by and electrically connected to one of the other bond pads of the first series of bond pads of the first daughter die.
1 more element
A method comprising:
- providing a first mother die having a top face and a bottom face, and a first side edge and a second side edge, and including a first circuitry, the top face including a plurality of bond pads including a first series of the bond pads located near a first side edge of the mother die and wherein each of the bond pads of the first series is connected to a portion of the first circuitry of the mother die;
- providing a first daughter die having a top face and a bottom face, and a first side edge and the second side edge, and a first circuitry that is identical to the first circuitry of the mother die, the top face including a plurality of bond pads including a first series of bond pads located near the second side edge, and further comprising electrical redistribution traces each respectively connected to one of the bond pads of the first series of the daughter die so that the bond pads of the daughter die are positioned in the near mirror image of the bind pads on the mother die;
- providing a lead frame having a top face and a bottom face and a plurality of leads including a first select pin lead and a second select pin lead;
- securing the mother die to the top face of the lead frame and wherein the first series of bond pads of the mother die are located near the plurality of leads of the lead frame, and securing the daughter die to the bottom face of the lead frame and wherein the first series of bond pads on the mother die are positioned near the plurality of leads of the lead frame;
- electrically connecting one of the bond pads of the first series of bond pads of the mother die to the first select pin lead without any other bond pads being electrically connected to the first select pin lead, and electrically connecting one of the bond pads of the first series of bond pads of the daughter die to the second select pin lead without any other bond pads being connected to the second select pin lead, and electrically connecting each one of the bond pads of the first series of bond pads of the mother die individually to a respective lead of the lead frame and electrically connecting each one of the bond pads of the first series of bond pads of the daughter die individually to a respective lead of the lead frame so that one the one bond pad of the mother die is electrical connected to the same lead as one of the bond pads of the daughter die with the exception of the select pin leads.
2 more elements
A product comprising:
- a first mother die having a top face and a bottom face, and a first side edge and a second side edge, the top face including a plurality of bond pads including a first series of bond pads located near the first side edge of the first mother die and a second series of bond pads located near the second side edge of the first mother die, and the bond pads including a first bond pad and other bond pads, and each bond pads being connected to a portion of a first circuitry of the first mother die;
- a first daughter die having a top face and a bottom face, and a first side edge and a second side edge, the top face including a plurality of bond pads including a first series of bond pads located near the second edge of the first daughter die and a second series of bond pads located near the first side edge of the first daughter die, and further comprising an electrical redistribution trace connected to each one of the bond pads individually and each electrical redistribution trace being connected to a first circuitry of the first daughter die that is identical to the first circuitry of the first mother die and so that the bond pads of the first daughter die are positioned at locations that are the near mirror image of the bond pads on the first mother die;
- a lead frame having a top face and a bottom face, a first side edge and a second side edge, and a plurality of leads, the plurality of leads including a first series of leads located near the first side edge of the lead frame and a second series of leads located near the second side edge of the lead frame and including a first select pin lead and a second select pin lead;
- the first mother die being connected to the top face of the lead frame and wherein the first series of bond pads of the first mother die are located near the first series of leads of the lead frame and the second series of bond pads of the first mother die are located near the second series of leads of the lead frame, and the daughter die being connected to the bottom face of the lead frame and wherein the first series of bond pads of the daughter die are positioned near the to the first series of leads of the lead frame and the second series of bond pads of the first daughter die are located near the second series of leads of the lead frame, and wherein one other bond pads of the mother die is connected to the first select pin lead and wherein one of the first bond pad of the daughter die is connected to the second select pin lead, and wherein each one of the other bond pads of the first series of bond pads of the first mother die is individually electrically connected to a respective lead of the first series of leads of the lead frame and wherein the respective lead of the first series of leads is also shared by and electrically connected to one of the other bond pads of the first series of bond pads of the first daughter die, and wherein each one of the other bond pads of the second series of bond pads of the mother die is individually electrically connected to a respective lead of the second series of leads of the lead frame and wherein the respective lead of the second series of leads is also shared and electrically connected to one other bond pads of the second series of bond pads of the first daughter die.
1 more element
Dependencies are inferred from the claim text.