Multi-chip semiconductor device
AssigneeNEC Electronics Corporation
InventorKazuhiro Taguchi
Life of this patent
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Abstract
There is provided a semiconductor device including (a) a package comprised of a base, a sidewall standing on the base at a periphery of the base, and a cover mounted over the sidewall, the base, sidewall and cover defining a closed adiabatic space in the package, (b) a first semiconductor chip mounted on the base in the close adiabatic space, and (c) a second semiconductor chip mounted on the cover. The semiconductor device makes it possible to prevent heat generated in an upper semiconductor chip from being transferred to a lower semiconductor chip, and more highly integrate semiconductor chips than a conventional one.
Claims15
A semiconductor device comprising:
- (a) a package defining a closed space therein, wherein said package has a surface defining a first boundary of the closed space, said surface including a recess;
- (b) a first semiconductor chip mounted in the recess adjacent to said closed space;
- and
- (c) a second semiconductor chip mounted on said package above the closed space;
- wherein said closed space is configured to prevent transfer of substantially all heat generated by the second semiconductor chip to the first semiconductor chip.
A semiconductor device comprising:
- (a) a package comprised of a base, a sidewall standing on said base at a periphery of said base, and a cover mounted over said sidewall, said base, sidewall and cover defining a closed space in said package;
- (b) a first semiconductor chip mounted in a recess in said base adjacent to said closed space;
- and
- (d) a second semiconductor chip mounted on said cover;
- wherein said closed space is configured to prevent transfer of substantially all heat generated by the second semiconductor chip to the first semiconductor chip.
A semiconductor device comprising:
- (a) a plurality of packages vertically stacked on one another, each of said packages being comprised of a base, a sidewall standing on said base at a periphery of said base, and a cover mounted over said sidewall, said base, sidewall and cover defining a closed space in each of said packages;
- and
- (b) a plurality of semiconductor chips each mounted in the recess in the base of one of said packaged adjacent to the closed space defined in the package;
- wherein each closed space is configured to prevent transfer of substantially all heat generated by ones of the plurality of semiconductor chips outside of the closed space to the semiconductor chip arranged in the closed space.
Dependencies are inferred from the claim text.