Semiconductor die package having a UV cured polymeric die coating
AssigneeMicron Technology, Inc.
InventorGuy Blalock
Life of this patent
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Abstract
A permanent protective semiconductor die coating made from a polymer that is fully curable through exposure to ultra violet light. A mixture of polymer resin and a photoactive compound is applied to the die and then cured through exposure to ultraviolet light to form the protective coating. In one preferred embodiment, the polymer resin is a phenol-formaldehyde epoxy resin and the photoactive compound is CD1011 (marketed under the brand name SARTOMER”. The coating may be applied as a thin protective film, such as a passivation layer, or as a thicker encapsulant used for semiconductor device packages. Such film coatings exhibit reduced film shrinkage and lower film stresses while maintaining mechanical properties comparable to polyimide film coatings.
Claims5
A semiconductor die package, comprising a semiconductor die and a permanent protective material surrounding substantially all of the die, the protective material fully curable by exposure to ultraviolet light and shrinking 10% or less by volume upon curing and wherein the protective material is formed from a mixture including a polymer resin and a photoactive compound.
A semiconductor die package, comprising a semiconductor die and a protective coating on at least one of the outer surfaces of the die, the protective coating formed from a mixture of a phenol-formaldehyde epoxy novolac resin and triaryl sulfonium hexafluorophosphate.
A semiconductor die package, comprising a semiconductor die and a protective coating on at least one of the outer surfaces of the die, the protective coating including a layer of silicon dioxide, a layer of silicon nitride and a layer of material formed from a mixture of a phenol-formaldehyde epoxy novolac resin and triaryl sulfonium hexafluorophosphate.
Dependencies are inferred from the claim text.