Hermetically sealing package for optical semiconductor and optical semiconductor module

Abstract

A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Dependencies are inferred from the claim text.