Inverse T-gate structure using damascene processing
AssigneeInternational Business Machines Corporation
InventorsJack A. Mandelman, Carl J. Radens, William R. Tonti
Life of this patent
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Abstract
A field effect transistor has an inverse-T gate conductor having a thicker center portion and thinner wings. The wings may be of a different material different than the center portion. In addition, gate dielectric may be thicker along edges than in the center. Doping can also be different under the wings than along the center portion or beyond the gate. Regions under the wings may be doped differently than the gate conductor. With a substantially vertical implant, a region of the channel overlapped by an edge of the gate is implanted without implanting a center portion of the channel, and this region is blocked from receiving at least a portion of the received by thick portions of the gate electrode.
Claims13
A semiconductor structure comprising:
- a substrate and a gate on said substrate, said substrate comprising an implanted region,
- wherein said gate comprises a first conductive portion comprising a first thickness in a first location and a second thickness in a second location, wherein said second thickness is less than said first thickness, and wherein said second thickness is located to allow doping to penetrate to create said implanted region,
- wherein said gate further comprises a second conductive portion disposed on said first conductive portion, said second conductive portion having a planar upper surface over said first location and said second location, and
- wherein said gate comprises a gate conductor and a gate dielectric and wherein said first conductive portion of said gate comprises a first material adjacent said gate dielectric and a second material adjacent said gate dielectric, said second trial being different from said first material.
A semiconductor device, comprising:
- a substrate:
- a gate dielectric on said substrate;
- and
- a gate conductor on said gate dielectric, said gate conductor comprising a first portion contacting said gate dielectric and a second portion contacting said gate dielectric, said first portion being of a material different than said second portion, wherein said first portion is thicker than said second portion, and a third portion overlying said first and second portions and having a planar upper surface.
A gate for use in an integrated circuit transistor, said gate comprising:
- a center section;
- and
- gate edges adjacent said center section,
- wherein said center section is thicker than said gate edges,
- wherein said center section and said gate edges comprise different materials
- wherein said center section and said gate edges form of an inverse-T shaped structure,
- further comprising a second portion covering said inverse-T shaped structure, wherein said second portion has a planar upper surface.
An integrated circuit transistor comprising:
- a substrate;
- a gate oxide over said substrate;
- and
- a gate over said gate oxide,
- wherein said gate comprises;
- a center section;
- and
- gate edges adjacent said center section,
- wherein said center section is thicker than said gate edges,
- wherein said center section and said gate edges comprise different materials
- wherein said center section and said gate edges form of an inverse-T shaped structure,
- further comprising a second portion covering said inverse-T shaped structure, wherein said second portion has a planar upper surface.
Dependencies are inferred from the claim text.