Grounding terminal and mounting structure of the same on a printed circuit board
AssigneeKitigawa Industries Co., Ltd.
InventorHideo Yumi
Life of this patent
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AssigneeKitigawa Industries Co., Ltd.
InventorHideo Yumi
Estimating the term…
Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
A grounding terminal for mounting to a printed circuit board and engagement with a grounding conductor, the grounding terminal comprising:
A grounding terminal for mounting to a printed circuit board and engagement with a grounding conductor, the grounding terminal comprising:
Dependencies are inferred from the claim text.