Electronic component
AssigneesNitto Denko Corporation, NEC Corporation
InventorsMasahiro Kubo, Ichiro Hazeyama, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi
Life of this patent
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Abstract
An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.
Claims11
An electronic component comprising a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between said circuit board and said semiconductor chip being filled with a sealing resin layer, wherein said sealing resin layer is formed of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.
Dependencies are inferred from the claim text.