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US 6,674,015 B2Granted
Multi-layer interconnection board
AssigneeFujitsu Limited
InventorShinji Aoki
Life of this patent
Estimating the term…
Abstract
A multi-layer interconnection board, includes a multi-layer structure in which plural interconnections are provided and which includes a ground layer, and a hole part provided in the multi-layer structure. A conductive part is provided on an internal wall part of the hole part.
Claims7
A multi-layer interconnection board, comprising:
- a multi-layer structure in which plural interconnections are provided and which includes a ground layer;
- and
- a hole part provided in the multi-layer structure,
- wherein a conductive part is provided on an internal wall part of the hole part, and
- wherein the hole part has a diameter so that a non-conductive convex part of a device which can be packaged on the multi-layer interconnection board is able to be inserted in the hole for positioning the device on the multi-layer interconnection board.
2 more elements
Dependencies are inferred from the claim text.