Cross substrate, method of mounting semiconductor element, and semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorAkio Nakamura
Life of this patent
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Abstract
A cross substrate and a method of mounting a semiconductor element are provided in which semiconductor elements can be mounted at a high density. Element side electrodes of a circuit forming surface of a semiconductor element and conductive filaments of a cross substrate are connected in a one-to-one correspondence by solder bumps. Thereafter, sealing is carried out by using a molten epoxy-based resin. In this way, a circuit forming surface side of the semiconductor element is sealed with sealing resin of the cross substrate, with the element side electrodes of the mounted semiconductor element electrically connected to conductive filaments which are wires of a cross substrate.
Claims9
A cross substrate comprising:
- at least one resin sealed layer of a cross member, said at least one resin sealed layer of a cross member having warp threads an weft threads, wherein a portion of at least one of the warp threads and the weft threads include a plurality of conductive thread-like wire members disposed substantially parallel to one another, with the thread-like wire members electrically insulated from one another;
- and
- a solder bump electrode disposed at one region of the thread-like wire members, said solder bump electrode being physically contacted to an electrode of an external semiconductor device for electrical connection to the external semiconductor device.
A cross substrate comprising:
- a plurality of conductive members extending in a predetermined first direction;
- a plurality of insulating members extending in a second direction intersecting said first direction, and disposed so as to traverse regions between adjacent conductive members;
- and
- at least one solder bump electrode, disposed at one region of one of the plurality of conductive members, the at least one solder bump electrode being physically contacted to an electrode of an external semiconductor device for electrical connection to the external semiconductor device.
Dependencies are inferred from the claim text.