Thermosetting adhesive material
AssigneeSony Chemicals Corp.
InventorsMotohide Takeichi, Hidekazu Yagi
Life of this patent
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Abstract
A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler, wherein the insulating inorganic filler content (a; vol %) and the elastic modulus of the thermosetting adhesive material after curing (E; GPa/30° C.) satisfy the following relational formula (1): 0.042a+0.9<E<0.106a+2.5 (1) and at the same time, the insulating inorganic filler content (a; vol %) and the tensile elongation (d; %) at 25° C. of the thermosetting adhesive material after curing satisfy the following relational formula (2) −0.072a+4<d<−0.263a+13 (2).
Claims7
A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, said thermosetting adhesive material containing electroconductive particles for anisotropic electroconductive connection, a thermosetting resin and an insulating inorganic filler,
- wherein the insulating inorganic filler content (a;
- vol %) and the elastic modulus of the thermosetting adhesive material after curing (E;
- Gpa/30 C) satisfy the following relational formula (1):
- 0.042a+0.9<E<0.106a+2.5 (1)
- and at the same time, the insulating inorganic filler content (a;
- vol %) and the tensile elongation (d;
- %) at 25° C. of the thermosetting adhesive material after curing satisfy the following relational formula (2)
- −0.072a+4<d<0.2632a+13 (2).
Dependencies are inferred from the claim text.