Microwave enhanced CVD system under magnetic field
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
Life of this patent
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Abstract
An improved chemical vapor deposition or etching is shown in which cyclotron resonance and photo or plasma CVD cooperate to deposit a layer with high performance at a high deposition speed. The high deposition speed is attributed to the cyclotron resonance while the high performance is attributed to the CVDs.
Claims42
A method of manufacturing a semiconductor device comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the resonance chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber;
- introducing a reactive gas into said reaction chamber;
- positioning a substrate having a surface in the reaction chamber wherein said substrate is horizontally arranged so that said surface faces toward said resonance chamber;
- exhausting said reaction chamber with an exhaust means wherein a port of said exhaust means is positioned between said substrate and said resonance chamber;
- and
- depositing a film on the surface of said substrate by plasma CVD.
A method of manufacturing a semiconductor device comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the resonance chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber;
- placing a substrate having a surface in the reaction chamber wherein said substrate is horizontally arranged so that said surface faces toward said resonance chamber;
- exhausting said reaction chamber with an exhaust means wherein a port of said exhaust means is positioned between said substrate and said resonance chamber;
- and then
- forming a film on the surface by plasma CVD.
A method of manufacturing a semiconductor device comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the resonance chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber;
- introducing a reactive gas into said reaction chamber;
- positioning a substrate having a surface in the reaction chamber wherein said substrate is horizontally arranged so that said surface faces toward said resonance chamber;
- exhausting said reaction chamber with an exhaust means wherein a port of said exhaust means is positioned between said substrate and said resonance chamber;
- and
- forming an insulating film on said surface by plasma CVD.
A plasma processing method comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the plasma forming chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber and has a side wall which extends perpendicularly;
- introducing a reactive gas into said reaction chamber;
- positioning a single substrate having a surface in the reaction chamber wherein said substrate is horizontally arranged so that said surface faces toward a single opening of said resonance chamber;
- and
- depositing a film on the surface of the surface of said substrate by plasma CVD.
A plasma processing method comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the plasma forming chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber and has a side which extends perpendicularly;
- introducing a first gas into said resonance chamber;
- exciting said first gas by said electron cyclotron resonance in said resonance chamber;
- introducing a second gas into said reaction chamber wherein said second gas is excited by the excited first gas;
- positioning a single substrate having a surface in the reaction chamber wherein said substrate is horizontally arranged so that said surface faces toward a single opening resonance chamber;
- and
- depositing a film on the surface of said substrate by plasma CVD.
A method of manufacturing a semiconductor device comprising:
- introducing a microwave into a resonance chamber;
- inducing a magnetic field in the plasma forming chamber to form an electron cyclotron resonance in order to form a plasma;
- providing a reaction chamber adjoining the resonance chamber wherein said reaction chamber is positioned above said resonance chamber and has a side wall which extends perpendicularly;
- introducing a first gas into said resonance chamber;
- introducing a second gas into said reaction chamber wherein said second gas is excited by the excited first gas;
- positioning a semiconductor in the reaction chamber wherein said semiconductor is horizontally arranged so that said semiconductor faces toward a single opening of said resonance chamber;
- and
- depositing an insulating film on the surface of said semiconductor by plasma CVD.
Dependencies are inferred from the claim text.