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US 6,673,710 B1Granted
Method of connecting a conductive trace and an insulative base to a semiconductor chip
AssigneeBridge Semiconductor Corporation
InventorCharles W. C. Lin
Life of this patent
Estimating the term…
Abstract
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a conductive trace and an insulative base, wherein the chip includes a conductive pad and the insulative base contacts the conductive trace on a side opposite the chip, then forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad, and then forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claims300
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip, a conductive trace, an insulative base and a metal base, wherein the chip includes a conductive pad, the conductive trace contacts a side of the insulative base that faces towards the chip, the metal base contacts a side of the insulative base that faces away from the chip, and the metal base overlaps the pad;
- then
- forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad;
- and then
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
2 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip that includes a conductive pad;
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base;
- then
- disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip, the conductive trace extends to a side of the insulative base that faces towards the chip, and the conductive trace overlaps the pad;
- then
- removing a portion of the metal base that overlaps the pad;
- then
- forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad;
- and then
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
7 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising the following steps in the sequence set forth:
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
- disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and overlaps the pad and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
- removing portions of the metal base that overlap the pad and contact the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
3 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- depositing solder paste into the via;
- reflowing the solder paste to form a solder pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
- providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
- applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
- and then, in the sequence set forth,
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip;
- removing a first portion of the metal base that overlaps the pad and a second portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
9 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer;
- forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer;
- forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base and the metal layer;
- then
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
- then
- removing portions of the metal base that overlap the pad and contact the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
8 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising the following steps in the sequence set forth:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, and the pillar is formed in the via from reflowed solder paste and extends through the insulative base and contacts the metal base and the routing line;
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip;
- removing a first portion of the metal base that overlaps the pad and a second portion of the metal base that contacts the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
5 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip, a conductive trace, an insulative base and a metal base, wherein the chip includes a conductive pad, the conductive trace contacts and adheres to a side of the insulative base that faces towards the chip, the metal base contacts and adheres to a side of the insulative base that faces away from the chip, and the metal base overlaps the chip;
- then
- forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad;
- and then
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
2 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip that includes a conductive pad;
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base;
- then
- disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip, the conductive trace extends to a side of the insulative base that faces towards the chip, and the conductive trace overlaps the pad;
- then
- removing a portion of the metal base that overlaps the pad by wet chemical etching, thereby exposing the insulative base;
- then
- forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad;
- and then
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
7 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
- disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and overlaps the pad and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
- then
- removing portions of the metal base that overlap the pad and contact the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
4 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- depositing solder paste into the via;
- reflowing the solder paste to form a solder pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
- providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
- applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
- then
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip;
- then
- removing a first portion of the metal base that overlaps the pad;
- removing a second portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip and the metal base does not contact the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
11 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer;
- forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer;
- forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base and the metal layer;
- then
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
- then
- removing a first portion of the metal base that overlaps the pad, thereby exposing a first portion of the insulative base;
- removing a second portion of the metal base that contacts the pillar, thereby exposing a second portion of the insulative base;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
9 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, and the pillar is formed in the via from reflowed solder paste and extends through the insulative base and contacts the metal base and the routing line;
- then
- mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip;
- then
- removing a first portion of the metal base that overlaps the pad;
- removing a second portion of the metal base that contacts the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
8 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip, a conductive trace, an insulative base and a metal base, wherein the chip includes a conductive pad, the conductive trace is laminated to a side of the insulative base that faces towards the chip, the metal base contacts the insulative base on a side that faces away from the chip, and the metal base overlaps the chip;
- then
- forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad;
- and then
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
2 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a semiconductor chip that includes a conductive pad;
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base;
- then
- disposing an adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip, the conductive trace extends to a side of the insulative base that faces towards the chip, and the metal base and the conductive trace overlap the chip;
- then
- removing a portion of the metal base by wet chemical etching, thereby exposing the insulative base;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad;
- and
- forming a connection joint that contacts and electrically connects the conductive trace and the pad.
6 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
- disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
- then
- removing a portion of the metal base that contacts the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
4 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- depositing solder paste into the via;
- reflowing the solder paste to form a solder pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
- providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
- applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
- then
- mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip;
- then
- removing a portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip and the metal base does not contact the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
10 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer;
- forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer;
- forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base and the metal layer;
- then
- mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
- then
- removing a portion of the metal base that contacts the pillar, thereby exposing a portion of the insulative base;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
8 more elements
A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising:
- providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
- forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
- forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, and the pillar is formed in the via from reflowed solder paste and extends through the insulative base and contacts the metal base and the routing line;
- then
- mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip;
- then
- removing a portion of the metal base that contacts the pillar;
- forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
- and
- forming a connection joint that contacts and electrically connects the routing line and the pad.
7 more elements
Dependencies are inferred from the claim text.