Semiconductor chip package and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChih Ming Chung
Life of this patent
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Abstract
This invention provides a method for manufacturing a semiconductor chip package which mainly utilizes a substrate having a organic surface protection thereon to package a central-pad chip. In the encapsulating process, since the molding flash is completely formed on the surface of the organic surface protection, the molding flash can be easily removed together with the organic surface protection without damaging the substrate surface. This invention further provides a method for manufacturing the substrate.
Claims4
A method of manufacturing a substrate for a semiconductor device, said method comprising the steps of:
- providing a printed circuit board having opposing upper and lower surfaces and a slot defined therein, the lower surface of the printed circuit board being, provided with a plurality of solder loads and a plurality of chip connection pads electrically connected to the solder pads, respectively, the lower surface of the printed circuit board being covered by a solder mask in a manner that the solder pads and the chip connection pads are exposed through the solder mask;
- masking the chip connection pads;
- and
- forming an organic surface protection on the solder mask and around the slot of the substrate;
- wherein the masking step includes the step of attaching a protective tape to the lower surface of the printed circuit board so as to cover the chip connection pads.
Dependencies are inferred from the claim text.