Method of manufacturing semiconductor device including semiconductor elements mounted on base plate
AssigneeOki Electric Industry Co., Ltd.
InventorsShinji Ohuchi, Shigeru Yamada, Yasushi Shiraishi
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Abstract
A method of manufacturing a semiconductor device includes mounting a first semiconductor element on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.
Claims24
A method for manufacturing a semiconductor device including a first semiconductor device having a plurality of bumps which are formed on a backside surface thereof, and a second semiconductor device having a plurality of terminals which are formed on a front surface thereof and which are to be electrically connected with said plurality of bumps, said second semiconductor device being mounted on an area which is located on the backside surface of said first semiconductor device and which does not have any bumps formed thereon, the method comprising:
- forming said plurality of bumps on the backside surface of a base plate of said first semiconductor device;
- placing a plurality of said second semiconductor devices on a mounting tape;
- and subsequently
- mounting said plurality of second semiconductor devices placed on said mounting tape, on said base plate.
The method for manufacturing a semiconductor device as claimed in claim wherein said first semiconductor device is a BGA semiconductor device.
A method of manufacturing a semiconductor device comprising:
- mounting a first semiconductor element on a first surface of a base plate, the base plate having a second surface opposite to the first surface;
- forming solder bumps on the second surface of the base plate, the solder bumps being electrically connected through the base plate to the first semiconductor element, the second surface having an area without solder bumps;
- and
- mounting at least one second semiconductor element to the base plate at the area without solder bumps, using a low molecular adhesive, to form the semiconductor device, wherein the low molecular adhesive loses adhesive strength when the low molecular adhesive is heated to 200° C. or greater,
- wherein the first semiconductor element is used to comprise a BOA type semiconductor device and the at least one second semiconductor element is used to comprise a CSP type semiconductor device.
A method of manufacturing a semiconductor device comprising:
- mounting a first semiconductor element on a first surface of a base plate, the base plate having a second surface opposite the first surface;
- forming solder bumps on the second surface of the base plate, the solder bumps being electrically connected through the base plate to the first semiconductor element, the second surface having an area without solder bumps;
- and
- mounting at least one second semiconductor element to the base plate at the area without solder bumps, using a high temperature solder, to form the semiconductor device,
- wherein the first semiconductor element is used to comprise a BOA type semiconductor device and the at least one second semiconductor element is used to comprise a CSP type semiconductor device.
A method for manufacturing a semiconductor device, comprising:
- preparing a base plate having a first surface on which a first semiconductor element is mountable thereon and a second surface on which a second semiconductor element is mountable thereon, wherein the first surface is opposite to the second surface, and wherein the second surface has a central region at which the second semiconductor element is mountable thereon and a peripheral region on which a plurality of conductive patterns are formed;
- mounting the first semiconductor element on the first surface of the base plate;
- preparing the second semiconductor element as having front and backside surfaces;
- forming a plurality of terminals on the front surface of the second semiconductor element;
- covering the front surface of the second semiconductor element and sidewalls of the terminals with a resin so that top surfaces of the terminals are exposed from the resin;
- mounting the second semiconductor element on the central region of the second surface of the base plate after the front surface of the second semiconductor element is covered by the resin, so that the front surface faces the base plate and the plurality of terminals are electrically connected with the plurality of conductive patterns;
- and
- molding the first semiconductor element by a sealing resin,
- wherein the base plate includes epoxy resin.
Dependencies are inferred from the claim text.