Solder material, device using the same and manufacturing process thereof

An electric or electronic device comprising parts which are joined with a solder material, the solder material consisting essentially of 0.01 to 2% by weight of aluminum, and the balance tin.

An electric or electronic device comprising parts which are joined with a solder material, the solder material consisting essentially of:

• tin and zinc, wherein the ratio of tin to zinc is within a range of 80/20 to 70/30 by weight.

A process for manufacturing an electric or electronic device, comprising:

• soldering with a first solder material at a first temperature;
• and soldering later than soldering with the first solder material, with a second solder material at a second temperature which is lower than the first temperature, wherein the first solder material comprises one of a solder (A), a solder (B) and a solder (C), the solder (A) comprising tin, zinc and silver, wherein the ratio of tin to zinc is within a range of 97/3 to 87/13 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, the solder (B) comprising tin, and zinc wherein the ratio of tin to zinc is within a range of 80/20 to 70/30 by weight, and the solder (C) consisting essentially of 0.01 to 2% by weight of aluminum, and the balance tin.