Thermal cutoff construction compositions
AssigneeTherm-O-Disc, Incorporated
InventorChristine M. Hudson
Life of this patent
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Abstract
A thermal cutoff member and compositions used to manufacture such members are described herein as including at least two organic compounds which, when sufficiently combined, give rise to a component which has a lower melt transition temperature than the initial organic compounds prior to combining the same. The thermal cutoff member is generally utilized in a thermal cutoff construction having an electrical switching unit that changes its operating condition when the member therein melts by being heated to a certain temperature for the particular material that forms the member being utilized.
Claims26
A thermal cutoff composition comprising:
- at least two crystalline organic compounds, said compounds having a melting point temperature of less than about 300° C. with the difference in melting point temperature of at least two organic compounds employed being not more than about 100° C.;
- and
- at least one component selected from the group consisting of binders, lubricants and coloring agents;
- wherein, the resulting thermal cutoff composition has a melting point temperature which is less than that of any of the individual organic compounds prior to being combined.
A thermal cutoff composition made by a process comprising the steps of:
- combining at least two crystalline organic compounds together with at least one component selected from the group consisting of binder, lubricant, and pigment, said compounds having a melting point temperature of less than about 300° C. with the difference in melting point temperature of the organic compounds employed being not more than about 100° C.;
- and wherein, upon combining said crystalline organic compounds with from 0-10% binder, from 0-5% lubricant and from 0-2% pigment, the resulting thermal cutoff composition is capable of withstanding a 240 volt, 60 Hz sinusoidal potential between electrical conductors at least 5° C. above the melt transition temperature for at least about one minute without conducting greater than 250 mA.
A thermal cutoff composition shaped to provide an actuating function at a target melting point, comprising:
- a combination of at least two organic compounds, said compounds having a melting temperature of less than about 300° C., with the difference in melting point temperature of at least 2 organic compounds employed being not more than 100° C.;
- 0-10% binder;
- 0-5% lubricant;
- and
- 0-2% pigment,
- wherein the melting point of the thermal cutoff composition is the target melting point, and is less than that of any of the individual organic compounds.
Dependencies are inferred from the claim text.