Lasable bond-ply materials for high density printed wiring boards

A method for interconnecting high density electronic circuits comprising the steps of:

• (a) forming a bond-ply material comprising a core having a first surface and a second surface wherein the core has a thickness of from about 5 microns to 200 microns and including from about 20 to 70 weight % non-woven reinforcement material selected from glass microfibers, organic fibers and mixtures thereof impregnated with a polymer, the bond-ply material also comprising a B-stage resin layer having a thickness of from about 2 micrometers to about 200 micrometers covering the core first surface, the core second surface, or both the core first surface and the core second surface;
• (b) forming a plurality of vias in the bond-ply material;
• (c) filling the vias with an electrically conductive material selected from a conductive paste or conductor precursor;
• (d) placing the bond-ply material between a first circuit element having at least one circuit region and a second circuit element having at least one circuit region such that the electrically conductive material located in at least one via contacts at least one circuit region associated with the first circuit element and at least one circuit region associated with the second circuit element to form an uncured multi-layer circuit;
• and
• (e) curing the uncured multi-layer circuit at a pressures of from 0 to 1000 psi and at a temperature of from 25 to about 400° C. to form a cured multi-layer circuit.