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US 6,672,945 B1Granted
Polishing apparatus and dressing method
AssigneeEbara Corporation
InventorsHisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
Life of this patent
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AssigneeEbara Corporation
InventorsHisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
Estimating the term…
A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when generating light rays for irradiating the polishing surface of the abrasive member, whereby dressing the polishing surface. A temperature control system control the temperature of the polishing surface of the abrasive member by sensing the temperature of the polishing surface with the temperature sensor. Mechanical dressing of the polishing surface, in addition to dressing by radiation of the polishing surface, may also be employed in order to flatten the entire polishing surface. The abrasive member preferably includes an abrasive particles, a binder and a photophilic for promoting the dressing of the polishing surface by light rays.
In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an abrasive member and subjected to a relative sliding motion there between, thereby causing the substrate to be polished,
In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an abrasive member and subjected to a relative sliding motion there between, thereby causing the substrate to be polished,
A method as set forth in claim 39, further comprising supplying a liquid to the polishing surface of the abrasive member during said irradiating of the polishing surface of the abrasive member with a light.
In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an abrasive member and subjected to a relative sliding motion therebetween, thereby causing the substrate to be polished,
Dependencies are inferred from the claim text.