Eccentric abrasive wheel for wafer processing
AssigneeWafer Solutions, Inc.
InventorsMichael Vogtmann, Krishna Vepa, Michael Wisnieski
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Abstract
The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.
Claims19
An apparatus for grinding a substrate, said apparatus comprising:
- a first spindle having a first spindle surface;
- an abrasive matrix coupled to a portion of the first spindle surface, the abrasive matrix defining an eccentric-shaped abrasive ring positioned generally adjacent a periphery of the first spindle surface;
- and
- a second spindle adapted to hold a substrate to be ground, said second spindle offset from said first spindle such that the abrasive ring is positioned above a center of the substrate when the second spindle is in a first position, and the abrasive ring is not positioned above the center of the substrate when the second spindle is in a second position.
A substrate grinding apparatus, comprising:
- a first spindle having an abrasive matrix coupled to a first surface of said spindle, said first spindle having a first axis of rotation;
- and
- a second spindle adapted to hold a substrate to be ground, said second spindle having a second axis of rotation;
- wherein said abrasive matrix defines an eccentric-shaped abrasive ring having a non-circular pattern.
A method of grinding a substrate, said method comprising:
- providing a substrate grinder comprising;
- a first spindle having an abrasive matrix coupled thereto, the abrasive matrix defining an eccentric-shaped abrasive ring positioned generally adjacent a periphery of the first spindle, said first spindle having a first axis of rotation;
- and
- a second spindle adapted to hold a substrate to be ground, said second spindle having a second axis of rotation;
- positioning said spindles such that at least a portion of said abrasive matrix is in contact with a substrate surface to be ground;
- simultaneously rotating said first and second spindles so that said abrasive matrix contacts said substrate surface;
- and
- translating said first spindle so that said abrasive matrix passes through a center of said substrate surface for only a portion of a time said first and second spindles are rotating.
Dependencies are inferred from the claim text.