Composite substrate preparing method, composite substrate, and EL device

Abstract

The invention aims to provide a method for preparing a composite substrate which has minimized surface asperities on a dielectric layer, which are otherwise developed under the influence of an electrode layer, unevenness upon printing, and surface roughness inherent to thick-film dielectrics, which eliminates a need for a polishing step, which is easy to manufacture, and which is applicable to the fabrication of a thin-film light-emitting device of high display quality, as well as the resulting composite substrate and a thin-film EL device using the same. The object is attained by a method for preparing a composite substrate, comprising the steps of forming at least an electrode and a green dielectric layer according to a thick-film technique on an electrically insulating substrate, thereby providing a composite substrate precursor, smoothing the surface of the precursor by WIP process, and firing to complete the composite substrate, as well as the resulting composite substrate and a thin-film EL device using the same.

Dependencies are inferred from the claim text.