Discrete device socket and method of fabrication therefor

A method for fabricating an integrated circuit socket, the method comprising:

• fabricating a socket layer;
• forming one or more cavities in a top surface of the socket layer, wherein the one or more cavities are formed in a region over which an integrated circuit package can be placed;
• and
• connecting at least one contact to the socket layer, wherein each contact includes a first member of conductive material that extends from the top surface into a cavity of the one or more cavities, and a second member of conductive material that provides at least part of a conductive path between the first member and a conductive structure within the socket layer, and wherein the first member at least partially holds in place and makes electrical contact with a discrete device inserted into the cavity by making direct contact with a terminal on a side surface of the discrete device, and wherein the second member includes a bridge member connected to the first member, and wherein connecting the at least one contact comprises attaching the bridge member to a pad on the top surface of the socket layer.

An integrated circuit socket and package comprising:

• a socket having multiple cavities formed in a region of a top surface of the socket over which an integrated circuit package can be placed;
• contacts connected to the socket, wherein each of the contacts includes a first member of conductive material that extends from the top surface into a cavity of the one or more cavities, and a second member of conductive material that provides at least part of a conductive path between the first member and a conductive structure within the socket, and wherein the first member at least partially holds in place and makes electrical contact with a discrete capacitor inserted into the cavity by making direct contact with a terminal on a side surface of the discrete capacitor;
• multiple discrete capacitors inserted into the multiple cavities;
• and
• the integrated circuit package, electrically and mechanically attached to the top surface of the socket over the region, wherein the integrated circuit package at least partially holds in place the multiple discrete capacitors.