Transfer film for use with a flexible circuit compression connector
AssigneeInterCon Systems, Inc.
InventorsDouglas A. Neidich, Grant R. Adams, Jr.
Life of this patent
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AssigneeInterCon Systems, Inc.
InventorsDouglas A. Neidich, Grant R. Adams, Jr.
Estimating the term…
A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board. A method of manufacturing the flexible circuit compression connector system that includes a compression assembly by forming the contacts into a preselected configuration and securing the contacts to the flexible substrate is also included.
A transfer film of deformable material having an array of apertures, each aperture including a contact comprised of conductive metallic material having at least a base and a head of preselected configuration, each aperture being smaller than a portion of each contact so that each contact is captured by the aperture, the conductive metallic material having a higher modulus of elasticity than the transfer film so that the transfer film can be separated from the metallic material without deforming the metallic material.
A transfer film assembly comprising:
A transfer film assembly comprising:
Dependencies are inferred from the claim text.