Thermal interface wafer and method of making and using the same
AssigneeLoctite Corporation
InventorRobert A. Rauch
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Abstract
A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.
Claims6
A generally rectangular thermal interface for facilitating heat transfer from an electronic component to a heat sink comprising at least one elongate vertically-oriented strip substrate having first and second sides with at least one layer of conformable, heat-conducting material formed upon a respective one of said sides, said at least one strip with at least one layer of heat-conducting material formed thereon being formed as a cross-sectional portion of an outwardly-spiraling coil to define a wafer interposable between said electronic component and said heat sink.
Dependencies are inferred from the claim text.