Method of the manufacture of cooling devices

Abstract

A method for manufacturing cooling devices for mounting on semiconductor devices. These cooling devices are made from several extruded shaped section part elements. These shaped section part elements are made from an aluminum alloy and have grooves and bead strips wherein these grooves and bead strips are fitted into each other by applying pressure in a transverse direction. The outward protruding groove walls of the shaped section elements or the bead strips are pushed into the corresponding grooves of neighboring shaped section elements. These groove walls or bead strips plastically deform by bending in so that each bead strip entering its associated groove is physically locked in place. In addition wires of high purity aluminum can be inserted into these grooves before the groove walls or the bead strips are compacted into their associated grooves. Through this method the connection points become liquid proof and the connection is securely formed in the perpendicular direction.

Dependencies are inferred from the claim text.